Posted by employer 3 weeks ago
First seen on Joblaze 1 week ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
In this role, the engineer focuses on developing and optimizing packaging module equipment, ensuring efficient production processes. Proficiency in mechanical design, process engineering, and familiarity with semiconductor packaging technologies are essential for success. This position is ideal for experienced engineers with a background in manufacturing or semiconductor industries. Intel's commitment to innovation and technology advancement makes this a dynamic environment for professionals looking to make an impact.
Joblaze insights
- Listed 7 days ago on Joblaze — tracked directly from Intel's career page.
- Intel has 690 other open roles including Silicon SoC Architect, Advanced Packaging Integration and Simulation Intern, APTM Facilities Ops AMR Cost Specialist.