Posted by employer 2 days ago
First seen on Joblaze 56 minutes ago
Last verified on the company career page 56 minutes ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
In this role, the Packaging Module Development Engineer focuses on designing and optimizing packaging solutions for semiconductor products, ensuring they meet performance and reliability standards. Proficiency in materials science, thermal analysis, and mechanical design is essential, along with experience in semiconductor packaging processes. This position is suitable for engineers with a solid background in packaging technology and a few years of relevant experience. Intel's emphasis on innovation in semiconductor solutions highlights the importance of this role within their engineering teams.
Joblaze insights
- Listed today — first seen on Joblaze October 17, 2026. Last confirmed on Intel's careers page October 17, 2026.
- This exact title is also open at 5 other locations at Intel: Malaysia, Kulim, Malaysia, Kulim, US, Arizona, Phoenix, US, Oregon, Hillsboro, US, Arizona, Phoenix.