Posted by employer 1 month ago
First seen on Joblaze 1 week ago
Last verified on the company career page 5 days ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
In this role, the Packaging Module Equipment Development Engineer focuses on designing and optimizing equipment for semiconductor packaging processes. Proficiency in mechanical engineering principles, along with experience in automation and process improvement, is essential for success. This position is ideal for mid to senior-level engineers with a background in semiconductor manufacturing or related fields. Intel's commitment to innovation and advanced technology makes this a dynamic environment for professionals looking to make an impact.
Joblaze insights
- Listed 7 days ago on Joblaze — tracked directly from Intel's career page.
- Intel has 690 other open roles including Silicon SoC Architect, Advanced Packaging Integration and Simulation Intern, APTM Facilities Ops AMR Cost Specialist.
Quick facts
- Is this full-time or contract?
- Full-time for this Packaging Module Equipment Development Engineer role at Intel.